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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2021.1
- 수록면
- 31 - 37 (7page)
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초록· 키워드
오류제보하기
Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.
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등록된 정보가 없습니다.
참고문헌 (29)
참고문헌 신청
M. Abtew / 2000 / Lead-free Solders in Microelectronics / Material Science and Engineering : R : Reports 27(5):95~141
T. J. Swanson / 2018 / Properties of Mixing SAC Solder Alloys with Bismuth-containing Solder Pastes for a Low Reflow Temperature Process
H. Nishikawa / 2015 / Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process / Mater. Trans. 56:1025~1029
L. A. Wentlent / 2018 / Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability / 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) :425~433
H. Nishikawa / 2015 / Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad / Journal of Materials Processing Technology 215:6~11
T. J. Swanson / 2018 / Properties of Mixing SAC Solder Alloys with Bismuth-containing Solder Pastes for a Low Reflow Temperature Process
H. Nishikawa / 2015 / Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process / Mater. Trans. 56:1025~1029
L. A. Wentlent / 2018 / Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability / 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) :425~433
H. Nishikawa / 2015 / Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad / Journal of Materials Processing Technology 215:6~11
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Nanocomposite SAC Solders for Improving Reliability of Soldering Technology
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광소자용 Low Ag 솔더볼의 열적 신뢰성 연구
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SAC305 솔더에 대한 열충격 시험 비교 사례 연구
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Ultrasonic-dispersed SAC 305 nanocomposite solder for mini LED bonding with high-temperature aging resistance
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자동차 전장품용 절연 솔더의 기계적 특성
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Investigations on the Corrosion Properties of Sn?0.5Cu?Bi?xAg Lead Free Solder Alloys in 3.5% NaCl Solution
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Enhancing solder joint reliability through advanced solder with Bi, Ni, and Pd: a comparative study of creep properties, IMC suppression, and mechanical properties
대한기계학회 춘추학술대회
2024 .06
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New High Entropy Alloy (HEA) Reinforced SAC 305 Solder
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Sn-Ag-Cu 무연합금의 미세구조 분석
한국결정성장학회지
2017 .01
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Electromigration Behavior of Cu Core Solder Joints Under High Current Density
Electronic Materials Letters
2020 .01
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Properties of low-temperature nanocomposite Sn-58Bi-Ta2O5 solder for mini LED bonding on flexible electronics
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2021 .11
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솔더 크기 및 부피에 따른 Sn-3.0Ag-0.5Cu 솔더 접합부 고온 장기 신뢰성 평가
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2022 .05
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